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The fourth industrial revolution ( 4IR or 4.0 Industry) conceptualises rapid change to technology, industries, and societal patterns and processes in the 21st century due to increasing interconnectivity and smart automation. Hence, the smart automation sector  booms up the demand of laser chip packaging and submount become a critical component in various laser system due to it’s unique insulation, thermal performance & mechanical characters. Dacian Precision provides high-quality submount ( customized products are available) to maximize laser chip package performance at end application.