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Service
Foundry Solution Platform
Wafer Level Photolithography
Wafer Level Chemical
& Mechanical Surface Treatment
Foundry Solution Providing Platform
Intricate pattern & 3D structure Crafting
Diversity Interconnect Structure build - up
Photolithography
PR Type
Process
Liquid PR
Dry Film
PR Ink
Coating: Spin/Print/Laminator
I/G/H Line
Resolution
L/S = 5/5um
Liquid PR Thickness: 1~60um
Dry Film Thickness: 30~180um
Application
Plating
DRIE (Selectivity Protection)
Lift off
Applicable Wafer Size: 4"~ 8"
Chemical & Mechanical Polish
Metal
Capability
Application
Copper
Cu Lapping: TTV<5µm
Cu CMP: Ra<30nm
Cu Pillar/Pad
RDL
Applicable Wafer Size: 4"~ 8"
Deep Reactive Ion Etching
Substrate
Capability
Application
Silicon/SiO2
Glass
Uniformity < 5%
Aspect Ration 1:40
PR Selectivity 1:80
Profile 90°±1°
Scallop < 50nm
TSV
Trench
Cavity
MEMS
Applicable Wafer Size: 4"~ 8"
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