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Service
High Efficient Metallization Platform
Ultra-Flat Plated Copper (UFPC)
High Uniformity
Au & Ni Plating
High Efficient Metallization Platform (HEMP)
High Density Platinum Plating (HDPP)
Precious Metal Alloy Tech (PMAT)
Metalization Platform
Process Type
Electro-Plating
Chemical-Plating
Metal Category
Cu Thickness: 5~200um
Ni/Au/Pt Thickness: 0.5~20um
AuSn/AuCo/AuNi/SnAg
Thickness: Customized
Ni/Pd/Au
Thickness: Customized
Substrate Type
Application
Copper Pillar/Via/Bump/RDL
Barrier Layer
Solder/Inorganic Sealing
Silicon/SiO2
AlN/Al2O3
Sapphire/Quartz/Glass
Polymer/PI
Molybdenum
Passivation Layer
Physical Vapor Deposition
TiCu/TiNi
Seed-Layer/UBM
Applicable Wafer Size: 4"~ 8"
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