top of page
產品服務
代工解決方案平台
Wafer Level Photolithography
Wafer Level Chemical
& Mechanical Surface Treatment
Foundry Solution Providing Platform
Intricate pattern & 3D structure Crafting
Diversity Interconnect Structure build - up
微影/光刻製程
光組類型
製作方式
Liquid PR
Dry Film
PR Ink
Coating: Spin/Print/Laminator
I/G/H Line
解析度
L/S = 5/5um
Liquid PR Thickness: 1~60um
Dry Film Thickness: 30~180um
相關應用
Plating
DRIE (Selectivity Protection)
Lift off
Applicable Wafer Size: 4"~ 8"
化學機械研磨製程
金屬總類
平坦化能力
相關應用
Copper
Cu Lapping: TTV<5µm
Cu CMP: Ra<30nm
Cu Pillar/Pad
RDL
Applicable Wafer Size: 4"~ 8"
深反應離子蝕刻製程
基板種類
製程能力
相關應用
Silicon/SiO2
Glass
Uniformity < 5%
Aspect Ration 1:40
PR Selectivity 1:80
Profile 90°±1°
Scallop < 50nm
TSV
Trench
Cavity
MEMS
Applicable Wafer Size: 4"~ 8"
bottom of page