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產品服務
高效率金屬化平台
Ultra-Flat Plated Copper (UFPC)
High Uniformity
Au & Ni Plating
High Efficient Metallization Platform (HEMP)
High Density Platinum Plating (HDPP)
Precious Metal Alloy Tech (PMAT)
高效率金屬化技術資料
製程形式
電鍍 (Electro-Plating)
化鍍 (Chemical-Plating)
金屬種類
Cu Thickness: 5~200um
Ni/Au/Pt Thickness: 0.5~20um
AuSn/AuCo/AuNi/SnAg
Thickness: Customized
Ni/Pd/Au
Thickness: Customized
基板種類
相關應用
Copper Pillar/Via/Bump/RDL
Barrier Layer
Solder/Inorganic Sealing
Silicon/SiO2
AlN/Al2O3
Sapphire/Quartz/Glass
Polymer/PI
Molybdenum
Passivation Layer
真空濺鍍 (Physical Vapor Deposition)
TiCu/TiNi
Seed-Layer/UBM
Applicable Wafer Size: 4"~ 8"
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